Quad Flat No-leads Package

Quad Flat No-leads Package
QFN (Quad Flat No-leads Package,Quad Flat No Leads Package), one of the surface mount packages. It is worth noting that the QFN package is completely different from the LCC package. The LCC still has extension pins, but the pins are bent to the bottom, while the QFN package does not have any extension pins at all. QFN is a name stipulated by the Japan Electron Machinery Industry Association.
 
Quad Flat No Leads (QFN) package is a type of surface mount technology package used for integrated circuits (ICs). It is a variation of the Quad Flat Package (QFP) with the leads extending out from the sides of the package instead of from the bottom.
 
QFN packages have a flat square or rectangular body with a lead frame on the perimeter of the package. The lead frame is either an etched pattern on the surface of the package or a metal frame that is stamped or etched and then attached to the package. The leads are usually arranged in a grid pattern and are very small, making QFNs suitable for small form factor applications.
 
The advantage of the QFN package is that it provides a small, low profile package with good thermal and electrical performance. Leadless Package with a Rectangular Shape also allows for easy automated assembly using surface mount technology. The lack of leads on the bottom of the package also means that there is more space on the PCB for other components or routing.
 
Rectangular Shape Leadless Package comes in a variety of sizes and configurations, including versions with exposed pads on the bottom of the package for improved thermal performance. They are commonly used in mobile devices, consumer electronics, and other small form factor applications.
 
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Basic Information
Name: Quad Flat No-leads Package / Quad Flat No Leads Package
Abbreviation: QFN
Nature: One of the surface mount packages
 
Introduction
QFN (Quad Flat No-leads Package, Quad Flat No-leads Package), one of the surface mount packages. QFN is a name specified by the Japan Electron Machinery Industry Association. There are electrode contacts on the four sides of the package. Since there are no leads, the mounting area is smaller than that of QFP, and the height is lower than that of QFP. However, when stress occurs between the printed substrate and the package, it cannot be relieved at the electrode contact. Therefore, it is difficult to have as many electrode contacts as there are QFP pins, generally from 14 to 100. The materials are ceramic and plastic. Basically ceramic QFN when there is LCC mark. The electrode contact center distance is 1.27mm. Plastic QFNs are a low-cost package on a glass epoxy printed substrate substrate. In addition to 1.27mm, the electrode contact center distance also has two types: 0.65mm and 0.5mm. This package is also known as plastic LCC, PCLC, P-LCC, etc.