Laird Tflex 300 Tflex360

Laird Tflex 300 Tflex360

Laird Tflex 300, at pressures of 50psi, will deflect to over 50% the original thickness. This high rate of

compliancy allows the material to “totally blanket” the component, enhancing thermal transfer.

The material has a very low compression set enabling the pad to be reused many times.

Laird Tflex360 Tflex 300

Thermal Gap Filler

Laird Tflex 300, in achieving its stellar compliancy, does not sacrifice thermal performance. With a

thermal conductivity of 1.2 W/mK, low thermal resistances can be achieved at low pressures.

Laird Tflex 300H is offered with a hard, metallized liner option for easy handling and improved

rework. The metallized liner’s lower coefficient of friction also allows for easy assembly of parts

that must slide together, such as a card into a chassis.

Laird Tflex 300TG is offered with a cut-through resistant Tgard™ silicone liner. The TG liner offers a

guaranteed dielectric barrier, and easier part handling for mass production.

FEATURES AND BENEFITS

• Extreme compliancy allows material to “totally blanket” components

• Thermal conductivity of 1.2 W/mK

• Low compression set enables the pad to be reused many times

• Environmentally friendly solution that meets regulatory requirements including RoHS and

REACH