BERGQUIST SP900S SIL PAD TSP 1600S

BERGQUIST SP900S SIL PAD TSP 1600S SIL PAD 900S

High Performance Insulator for Low-Pressure Applications

Features and Benefits
• Thermal impedance: 0.61©C-in. 2 /W
(at 50 psi)
• Electrically isolating
• Low mounting pressures
• Smooth and highly compliant surface
• General-purpose thermal interface
material solution

The true workhorse of the SIL PAD product family, BERGQUIST SIL PAD TSP 1600S thermally conductive
insulation material is designed for a wide variety of applications requiring high thermal performance and electrical isolation. These applications also typically have low mounting pressures for component clamping.
BERGQUIST SP900S material combines a smooth and highly compliant surface characteristic with high thermal conductivity. These features optimize
the thermal resistance properties at low pressures.

Typical Applications Include:
• Power supplies
• Automotive electronics
• Motor controls
• Power semiconductors
Configurations Available:
• Sheet form, die-cut parts and roll form
• With or without pressure sensitive adhesive