BERGQUIST SP800 SIL PAD 800 SIL PAD TSP 1600

BERGQUIST SP800 SIL PAD 800 SIL PAD TSP 1600

High Performance Insulator for Low-Pressure Applications

BERGQUIST SP800 Features and Benefits
• Thermal impedance: 0.45©C-in. 2 /W
(at 50 psi)
• High-value material
• Smooth and highly compliant surface
• Electrically isolating

The BERGQUIST SP800 family of thermally conductive insulation materials is designed for applications requiring high thermal performance and electrical isolation. These applications
also typically have low mounting
pressures for component clamping.
BERGQUIST SIL PAD TSP 1600 material
combines a smooth and highly compliant
surface characteristic with high thermal
conductivity. These features optimize
the thermal resistance properties at
low pressure.

BERGQUIST SIL PAD 800 Typical Applications Include:
• Power supplies
• Automotive electronics
• Motor controls
• Power semiconductors
Configurations Available:
• Sheet form, die-cut parts and roll form
• With or without pressure sensitive adhesive