BERGQUIST Q PAD II SIL PAD TSP Q2500 BERGQUIST Q PAD2

BERGQUIST SIL PAD TSP Q2500

Features and Benefits

• Thermal impedance: 0.22­C-in.2/W

(at 50 psi)

• Maximum heat transfer

• Aluminum foil-coated both sides

• Designed to replace thermal grease
BERGQUIST SIL PAD TSP Q2500 is a composite of aluminum foil-coated on both sides with thermally and electrically

conductive SIL PAD rubber. The material is designed for those applications in which maximum heat transfer is needed

and electrical isolation is not required.BERGQUIST Q PAD2 is the ideal thermal interface material to replace

messy thermal grease compounds.

BERGQUIST Q2 eliminates problems associated with grease such as contamination of reflow solder or cleaning

operations. Unlike grease, BERGQUIST QII can be used prior to these operations.

BERGQUIST Q PAD II also eliminates dust collection which can cause possible surface shorting or heat buildup.