BERGQUIST HI-FLOW 565UT

BERGQUIST HI-FLOW THF 3000UT Features and Benefits

• Thermal impedance: 0.05­C-in.2/W

(at 25 psi)

• High thermal conductivity: 3.0 W/mk

• Phase change softening temperature

52­C

• Naturally tacky

• Tabulated for ease of assembly

BERGQUIST HI-FLOW THF 3000UT is a naturally tacky, thermally conductive phase change

material which is supplied in an easy to use tabulated pad form. In the application the material

undergoes a phase change softening, starting near 52­C. The phase change softening feature

improves handling characteristics prior to a facilitated assembly. At application temperatures and

pressures, BERGQUIST HI-FLOW 565UT wets out the thermal interfaces producing a very

low thermal impedance.



BERGQUIST HI-FLOW 565UT Typical Applications Include:

• Processor lid to heat sink

• Processor die to lid or heat sink

• FBDIMM to heat spreader

Configurations Available:

• Tabulated in roll form, kiss-cut parts – no holes

• BERGQUIST HF565UT is limited to a square or rectangular part design.

Dimensional tolerance is +/- 0.020 in. (0.5 mm)