BERGQUIST HF625 HI FLOW THF 500

BERGQUIST Hi-Flow 625 is a film-reinforced phase change material.

The product consists of a thermally conductive 65ÿC phase change compound coated on PEN film.

BERGQUIST HF625 is designed to be used as a thermal interface material between electronic power devices that require electrical isolation and a heat sink.

The reinforcement makes Hi-Flow 625 easy to handle, and the 65ÿC phase change temperature of the coating material eliminates shipping and handling problems.

The PEN film has a continuous use temperature of 150ÿC.HI FLOW THF 500 is tack-free and scratch-resistant at production temperature and

does not require a protective liner in most shipping situations. The material has the thermal performance of 2-3 mil mica and grease assemblies.



BERGQUIST HF625 Typical Applications Include:

1.Spring / clip mounted

2. Power semiconductors

3.Power modules



HI FLOW THF 500 Configurations Available:

1.Sheet form, die-cut parts and roll form

2. With or without pressure sensitive adhesive