BERGQUIST GF3500S35 GAP FILLER TGF 3600 GAP FILLER 3500S35 Thermal paste

Thermal paste of BERGQUIST GF3500S35 GAP FILLER TGF 3600 GAP FILLER 3500S35

Thermally Conductive Liquid Gap-Filling Material

BERGQUIST GF3500S35 is a two-component, liquid gap-filling material, cured at either room or elevated temperature, featuring ultra-high thermal performance and outstanding softness.
Prior to curing, the material maintains
good thixotropic characteristics as well
as low viscosity. The result is a gel-like
liquid material designed to fill air gaps
and voids yet flow when acted upon by
an external force (e.g., dispensing or
assembly process). The material is an
excellent solution for interfacing fragile
components with high topography and/
or stack-up tolerances to a universal heat
sink or housing. Once cured, it remains a
low modulus elastomer designed to assist
in relieving CTE stresses during thermal
cycling yet maintain enough modulus to
prevent pump-out from the interface.
BERGQUIST GAP FILLER TGF 3600 will
lightly adhere to surfaces, thus improving
surface area contact. BERGQUIST GAP FILLER 3500S35 is not designed to be a structural adhesive.

Thermal paste Typical Applications Include:
• Automotive electronics
• Discrete components to housing
• PCBA to housing
• Fiber optic telecommunications equipment
Configurations Available:
• Supplied in cartridge or kit form