BERGQUIST GAP FILLER TGF 1500 Gap Filler 1500 BERGQUIST GF1500

BERGQUIST GAP FILLER TGF 1500 is a two-part, high performance, thermally

conductive, liquid gap-filling material, which features exceptional slump resistance and

high shear thinning characteristics for optimized consistency and control during dispensing.

The mixed system will cure at room temperature and can be accelerated with the

addition of heat. Unlike cured thermal pad materials, a liquid approach offers infinite thickness

variations with little or no stress to the sensitive components during assembly. BERGQUIST

GF1500 exhibits low level natural tack characteristics and is intended for use in applications

where a strong structural bond is not required. As cured,BERGQUIST Gap Filler 1500 (Two-Part)

provides a soft, thermally conductive,form-in-place elastomer that is ideal for fragile assemblies

and filling unique and intricate air voids and gaps.



BERGQUIST GF1500 Typical Applications Include:

• Automotive electronics

• Computers and peripherals

• Between any heat generating semiconductor and a heat sink

• Telecommunications

Configurations Available:

• Supplied in cartridge or kit form

• With or without glass beads